GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity. This material is ideal for any manufacturing facility that is a silicone-free environment.
GEL 37 is the next generation of GELs, with an increased flow rate and higher thermal conductivity than GEL 30. It is specifically designed for more consistent and repeatable dispensing by minimizing batch-to-batch flow rate variations in high volume applications.
Like all GELs, it is a fully cured dispensable material designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility.
Gel 30 is a fully cured dispensable gel designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility.
Gel 45 is a fully cured dispensable gel that has 4.5 W/m-K thermal conductivity and is designed as a one component fully cured system. This allows the elimination of time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility.
Gel 30G s a 3.5 W-m/K, fully cured dispensable thermal interface gel with added glass beads for bondline thickness control. It requires no mixing or curing, providing superior design flexibility.
