THERMAL INTERFACE MATERIALS

gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.

phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.

tapes are formulated with acrylic or silicone based pressure sensitive adhesive (PSA) loaded with thermally conductive fillers. They are designed to securely bond heat sinks to power dissipating components without an additional clamping mechanism.

thermally conductive compounds are two-component materials that require a cure and are used on complex geometries for cooling of multiple height heat generating components without the expense of molded sheets or gap pads.  Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures. They differ from GEL dispensable materials, which are single component and do not require a cure.

thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate.

thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. The excellent surface wetting results in low interfacial resistance.