PRODUCT OVERVIEW

Gel 45 is a fully cured dispensable gel that has 4.5 W/m-K thermal conductivity and is designed as a one component fully cured system. This allows the elimination of time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility.

Features/Benefits:

• Easily dispensable

• Fully-cured / No pump out

• High bulk thermal conductivity

• Low thermal impedance

• Ultra low compression force

• High tack surface & reworkable

• Proven long-term reliability

Product Attributes:

• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders

• Proven reliability in extreme temperature cycling and shock & vibration

• Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.

• Accommodates a variety of bond line thicknesses for application to multiple devices

• Gel 45 has been successfully used to fill a variety of different gap thickness

• High bulk thermal conductivity

• Excellent performance-to-price

• Compatible with high volume, automated dispense processes

• Meets Telcordia (Bellcore) silicone specifications

Typical Applications:

• Automotive Electronic Control Units (ECUs)

• Power Supplies & Semiconductors

• Memory & Power Modules

• Microprocessors / Graphics

• Processors

• Flat Panel Displays & Consumer Electronics

TECH SPECIFICATIONS