PRODUCT OVERVIEW
Gel 30G s a 3.5 W-m/K, fully cured dispensable thermal interface gel with added glass beads for bondline thickness control. It requires no mixing or curing, providing superior design flexibility.
Features/Benefits:
• Same as THERM-A-GAP GEL 30, but with added glass beads for bondline thickness control
• Fully-cured / No pump out
• High bulk thermal conductivity
• Low thermal impedance
• Ultra low compression force
• High tack surface & reworkable
• Proven long-term reliability
Product Attributes:
• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
• Proven reliability in extreme temperature cycling and shock & vibration
• Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.
• Accommodates a variety of bond line thicknesses for application to multiple devices
• Successfully used to fill a variety of different gap thickness
• Compatible with high volume, automated dispense processes
• Meets Telcordia (Bellcore) silicone specifications
Typical Applications:
• Automotive Electronic Control Units (ECU’s)
• Power Supplies & Semiconductors
• Memory & Power Modules
• Microprocessors / Graphics
• Processors
• Flat Panel Displays & Consumer Electronics
TECH SPECIFICATIONS
PERFORMANCE CHARACTERISTICS
COLOR
Pink
FLOW RATE
20 grams/min
SPECIFIC GRAVITY
3.2
DEFLECTION AT PRESSURE
2
FILM THICKNESS
0.1 mm
THERMAL CONDUCTIVITY
3.5 W/m-K
HEAT CAPACITY
1 J/g-K
COEFFICIENT OF THERMAL EXPANSION
150 ppm/K
OPERATING TEMPERATURE
-67 to 392 °F
DIELECTRIC STRENGTH
200 VAC/mil
VOLUME RESISTIVITY
10^14 Ω-cm
DIELECTRIC CONSTANT
7 @ 100 kHz
DISSIPATION FACTOR
0.002 @ 100 kHz
SPECIFICATIONS MET
UL 94 V-0, RoHS
OUTGASSING TOTAL MASS LOSS
0.15 (0.05) %
SHELF LIFE
18 Months