PRODUCT OVERVIEW
GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity. This material is ideal for any manufacturing facility that is a silicone-free environment.
GEL 25NS has been designed to eliminate silicone contamination and provide the maximum thermal performance in devices requiring minimal thermal resistance and high component reliability.
GEL 25NS is compatible with soldering chemicals and components can be repainted with ease and has no silicone staining or pump out. This single component product requires no mixing or curing providing superior design flexibility.
Features/Benefits:
• No silicone contamination
• Free of paint wetting impairment substances (PWIS) according to ASTMs.
• Easily dispensable
• Pre-cured / No pump out
• High bulk thermal conductivity
• Low thermal impedance
• Ultra-low compression force
• High tack surface & reworkable
• Proven long-term reliability
Typical Applications:
• Automotive electronic control units (ECUs)
• Vision control systems
• LEDs
• Power supplies
• Semiconductors
• Memory
• Power modules
• Microprocessors / graphics processors
• Flat panel displays
• Consumer electronics
TECH SPECIFICATIONS
COLOR
Yellow
SPECIFIC GRAVITY
2.6
DEFLECTION AT PRESSURE
40% at 3 psi
HEAT CAPACITY
0.96 J/g-K
COEFFICIENT OF THERMAL EXPANSION
≤ 300 ppm/K
OPERATING TEMPERATURE
-67 to 257 °F (-55 to 125 °C)
DIELECTRIC STRENGTH
200 Vac/mil (8.0 kVac/mm)
VOLUME RESISTIVITY
10^14 Ω-cm
DIELECTRIC CONSTANT
6.7 @ 100 KHz
SPECIFICATIONS MET
RoHS Compliant
OUTGASSING TOTAL MASS LOSS
0.23 % TML (0.04 % CVCM)
SHELF LIFE
12 months from date of manufacture
FLAMMABILITY RATING
UL 94 V-0
POLYMER MATERIAL OPTIONS
Urethane
MINIMUM BONDLINE THICKNESS
0 to 0.004 in
FLOW RATE
0-19 g/min
THERMAL CONDUCTIVITY
2 to 2.9 W/m-K