THERMALLY CONDUCTIVE CURE-IN-PLACE POTTING AND UNDERFILL MATERIALS

thermally conductive compounds are two-component materials that require a cure and are used on complex geometries for cooling of multiple height heat generating components without the expense of molded sheets or gap pads.  Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures. They differ from GEL dispensable materials, which are single component and do not require a cure.