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SUNYOUNG wide variety of Thermal Interface Materials enables designers to create thermal management solutions for their most challenging electronics packaging needs.
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- THERMAL INTERFACE MATERIALS
- THERMALLY CONDUCTIVE GAP FILLER PADS
THERMALLY CONDUCTIVE GAP FILLER PADS
THERMALLY CONDUCTIVE GAP FILLER PADS
gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.