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Thermal Conductivity of Silicone Pad

Thermal Conductivity of Silicone Pad

YUNEX-WS

Thermally Conductive Silicone Interface Pad YUNEX-WS is designed to provide an excellent heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.

Features and Benefits

YUNEX-WS thermal conductive pad are used to fill in air gaps between heat-generating electronic component and heatsinks, metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high compliance.

YUNEX-WS thermal conductive pad series is very cost-effective materials which is made through advanced manufacturing process and with meeting the requirement of UL 94 V0, RoHs and Reach compliance.

 

Thermally Conductive Gap Filler Pads

Description

YUNEX WS gap-filler sheets and pads offer excellent thermal properties and highest conformability at low clamping forces.

Features / Benefits

  • Ultra-low deflection force
  • High thermal conductivity
  • High tack surface reduces contact resistance
  • UL recognized V-0 flammability
  • RoHS compliant

Typical Applications

  • Telecommunications equipment
  • Consumer electronics
  • Automotive electronics (ECUs)
  • LEDs, lighting
  • Power conversion
  • Power semiconductors
  • Desktop computers, laptops, servers
  • Handheld devices
  • Memory modules
  • Vibration dampening.

 

YUNEX WS10H High Thermal Conductivity Gap Filler Pads

Description

YUNEX WS gap Fillers offer the highest thermal conductivity for low to moderate clamping force applications.

Features/Benefits

  • High thermal conductivity
  • Softer compared to similar high conductivity material.

Typical Applications

  • Telecommunications equipment
  • Consumer electronics
  • Automotive electronics (ECUs)
  • LEDs, lighting
  • Power conversion
  • Power semiconductor